1.Mold design is currently divided into 2D design and 3D design. Two-dimensional design forms often use CAD software, and three-dimensional design forms often use UG design software.
2.The heat treatment process generally includes three processes of heating, heat preservation and cooling, and sometimes there are only two processes of heating and cooling. These processes are interconnected and uninterrupted. Heating is one of the important processes of heat treatment and the heating temperature is one of the important process parameters of the heat treatment process. Selecting and controlling the heating temperature is the main problem to ensure the quality of the heat treatment. The transformation takes a certain amount of time, so when the surface of the metal workpiece reaches the required heating temperature, it must be maintained at this temperature for a certain period of time to make the internal and external temperatures consistent and the microstructure to be completely transformed. This period of time is called the holding time. When high-energy density heating and surface heat treatment are used, the heating speed is extremely fast, and there is generally no holding time, while the holding time of chemical heat treatment is often longer. Cooling is also an indispensable step in the heat treatment process. The cooling method varies with different processes, mainly controlling the cooling rate.
3.The first type: wet grinding, adding or coating some liquid abrasives on the grinding surface, so that it continuously rolls with the grinding tool to form a cutting motion, mainly used for rough grinding.
The second type: dry grinding, which is to put the material with uniform abrasive in the surface layer of the grinding tool. Dry grinding is often used for fine grinding, and all the powders are relatively fine and tiny.
The third type: semi-dry grinding, a bit like wet grinding, the abrasive used is a paste-like grinding paste. It can be operated by hand or on a grinding machine. Before precision optical grinding, a good machining accuracy should be reserved.
4.The wire cutting effect is good and the deformation is small, mainly for the molds that have high requirements on accuracy and smoothness.
Mold test, AssemblyFrame mold: Make sure that there are no debris and other debris on the work surface of the punch press and the die seat; the mold should be in the center of the work surface and parallel to the work surface; the mold and the work surface of the punch press and the upper slider should be fastened firmly.Feeding: Manual feeding is used for the initial feeding. First pass the material strip through the die, use the side roller of the feeder to position the material strip, take out the material strip, and then send the material strip to the punching process hole station and the first guide pin Punch down in between. Then use the guide pin to align the positioning hole for precise positioning, and feed a pitch one by one. When feeding, carefully observe the abnormality during feeding, such as tape, material, insufficient flash position, etc.Die adjustment and maintenance: first remove the obstacles that affect the continuous feeding of the continuous stamping die: strips, jams, stalls, etc.; secondly solve the problems affecting the appearance of the product: chip jumping, indentation, die marks, strain, flash position If it is not enough, deal with the blockage problem at the same time; adjust and repair the size parameters, functional parameters and assembly parameters of the product after according to the adjustment and maintenance conditions during the mold test, fill in the mold test report truthfully, and correct the mold drawing.
Detection Sample measurement: Measure the sample size and functional parameters according to the product blueprint, and fill in the self-inspection record. Finally, submit the samples, self-inspection records, mold test reports, and revised mold drawings to the design engineer.
6.Mold packaging and transportation
Due to the particularity of mold parts, great attention will be paid to packaging materials and transportation safety issues during packaging and transportation.